Micron Technology DRAM SDRAM-DDR4, Part #: MT40A1G16RC-062E IT:B TR features: • VDD = VDDQ = 1.2V ±60mV • VPP = 2.5V, –125mV, +250mV • On-die, internal, adjustable VREFDQ generation • 1.2V pseudo open-drain I/O • TC maximum up to 95°C – 64ms, 8192-cycle refresh up to 85°C – 32ms, 8192-cycle refresh at >85°C to 95°C • 16 internal banks (x4, x8): 4 groups of 4 banks each • 8 internal banks (x16): 2 groups of 4 banks each • 8n-bit prefetch architecture • Programmable data strobe preambles • Data strobe preamble training • Command/Address latency (CAL) • Multipurpose register READ and WRITE capability • Write leveling • Self refresh mode • Low-power auto self refresh (LPASR) • Temperature controlled refresh (TCR) • Fine granularity refresh • Self refresh abort • Maximum power saving • Output driver calibration • Nominal, park, and dynamic on-die termination (ODT) • Data bus inversion (DBI) for data bus • Command/Address (CA) parity • Databus write cyclic redundancy check (CRC) • Per-DRAM addressability • Connectivity test • JEDEC JESD-79-4 compliant • sPPR and hPPR capability

MIL:MT40A1G16RC-062E IT B TR

MT40A1G16RC-062E IT:B TR