Xilinx XC7S50-2FTGB196C 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor,cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demandinghigh-performance applications. The 7 series FPGAs include:• Spartan®-7 Family: Optimized for low cost, lowest power, and highI/O performance. Available in low-cost, very small form-factorpackaging for smallest PCB footprint.• Artix®-7 Family: Optimized for low power applications requiring serialtransceivers and high DSP and logic throughput. Provides the lowesttotal bill of materials cost for high-throughput, cost-sensitiveapplications.• Kintex®-7 Family: Optimized for best price-performance with a 2Ximprovement compared to previous generation, enabling a new classof FPGAs.• Virtex®-7 Family: Optimized for highest system performance andcapacity with a 2X improvement in system performance. Highestcapability devices enabled by stacked silicon interconnect (SSI)technology.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable anunparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% lesspower than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.FPGA Features• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip databuffering.• High-performance SelectIO™ technology with support for DDR3interfaces up to 1,866 Mb/s.• High-speed serial connectivity with built-in multi-gigabit transceiversfrom 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering aspecial low-power mode, optimized for chip-to-chip interfaces.• A user configurable analog interface (XADC), incorporating dual12-bit 1MSPS analog-to-digital converters with on-chip thermal andsupply sensors.• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adderfor high-performance filtering, including optimized symmetriccoefficient filtering.• Powerful clock management tiles (CMT), combining phase-lockedloop (PLL) and mixed-mode clock manager (MMCM) blocks for highprecision and low jitter.• Quickly deploy embedded processing with MicroBlaze™ processor.• Integrated block for PCI Express® (PCIe), for up to x8 Gen3Endpoint and Root Port designs.• Wide variety of configuration options, including support forcommodity memories, 256-bit AES encryption with HMAC/SHA-256authentication, and built-in SEU detection and correction.• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members inthe same package. All packages available in Pb-free and selectedpackages in Pb option.• Designed for high performance and lowest power with 28 nm,HKMG, HPL process, 1.0V core voltage process technology and0.9V core voltage option for even lower power.